Printed Circuit Board (PCB) design from Altium is now directly connected to Onshape CAD models thanks to a unified cloud-native workflow that eliminates file-based PCB data exchange between electrical and mechanical design.
The connector allows for electrical and mechanical engineering teams to collaborate more effectively, keeping changes synchronised across both platforms during a workflow that requires close coordination.
Working entirely in the cloud, it requires no file conversions, downloads or manual data transfers, with changes made in either platform automatically reflected in the other, eliminating version mismatches. The detailed electrical history lives in Altium, and mechanical history lives in Onshape, connected in real time so teams can trace and manage what changed and when.
Accessible from any browser, all project stakeholders can review, comment on and markup designs from anywhere, with no software installation required.
Onshape says the move allows teams to assess fit early, track changes in real time and stay aligned as designs evolve. Nikolay Ponomarenko, VP Altium R&D, called the announcement an important milestone for cloud-native engineering. “By expanding our direct ECAD-MCAD CoDesign technology, we are enabling a truly cohesive connection between leading cloud-based design platforms,” he said .
“In a complex, fast-paced industry, cloud data enables engineers to collaborate in real-time within a unified workflow across design domains. This eliminates all risks imposed by manually sharing files. This level of synchronisation keeps teams aligned from the very beginning of the design process and lays the foundation for even deeper collaboration in the future.”
Onshape GM David Katzman, added. “Connecting electrical and mechanical design in real-time is a critical step toward fully digital product development.
“By bringing these workflows together in a single cloud-native environment, we give teams continuous access to a shared, real-time product definition so they can move faster, stay aligned and focus on building better products.”
