AMD unveils new 32GB server GPU for HPC
AMD is upping the ante in GPU compute with its new FirePro S9170 server GPU…
EOS targets mould and die sector with GF Machining tie-up
Head of GF Machining Solutions Pascal Boillat with EOS founder and CEO Dr. Hans J.…
EPLAN Experience looks to aid efficiency and optimisation in engineering projects
EPLAN is looking to ensure users get the most from their CAE software EPLAN is…
Altair calls for simulation specialists to test out High-Performance Computing in the cloud
Simulation specialists – apply with your project for the chance of a cloud-computing boost Altair…
New Internet of Things product family from PTC offers a ‘clearer pathway to interconnected world’
Alstom is an early adopter of PTC Integrity With momentum clearly behind it, PTC has…
Interactive CL3VER animations, straight from CAD data, future of marketing for robotics company
The interactive 3D model allows users to get a ‘trade show experience’ through any internet…
Kenesto introduces alternative to general purpose cloud storage for engineers and designers
Kenesto has launched its own cloud drive – with free and paid options Two new…
Molex3D MuCell simulates addition of gas bubbles into plastics moulding for lighter parts
The controlled addition of bubbles to injection moulded parts – like in a chocolate bar…
Materialise releases EOS Build Processor 1.2
Release 1.2 of Materialise’s EOS sintering package links forms an interface between the file fixing…
Back to the basics in ideation: Chris Cheung sketches out what new apps mean for designers
How is digital sketching fitting into your workflow, if at all? Sketching still forms the…
