ansys 2021 R2 release mechanical

Ansys 2021 ramps up the speed in R2 update

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Speed is at the core of the Ansys 2021 R2 release, with the simulation experts boasting productivity enhancements aplenty, on top of access to high level computing power via Ansys Cloud.

Optical simulation meshing enhancements see speeds grow by up to 20-times faster and local meshing up to 100-times faster.

Ansys Mechanical 2021 R2 has reportedly also streamlined cyclic modal and structural analyses using a new multistage cyclic symmetry capability that is capable of decreasing run times by up to 50-times when compared against a full 360 degree solve.

In fluids, Ansys 2021 R2 provides up to a 5-times speed increase for high-speed flows to Mach 30 and above, with improved treatment of reaction sources in the density-based solver.

ansys 2021 R2 release bondwire
Bond wire simulation using PHI Plus Mesher in Ansys HFSS

Ansys says that simplified, reduced-order workflows have been added throughout the R2 update, to provide quick answers to product design and development problems, allowing engineers to concentrate computing power on the best design candidates.

A new Phi Plus mesher meets 3D integrated circuit package challenges by accelerating initial meshing for tasks like bondwire package electromagnetics and signal integrity analysis by an average of 6-10-times.

In addition to directly speeding up simulation, engineers can now work more efficiently via an open platform that integrates multiple toolsets – with Ansys Mechanical users able to embed Python programming language scripts directly into their models, for example, to automate the flow using industry standard open-source coding.

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Automation and collaboration are recurring themes in with updates enabling teams to work in an ecosystem that connects early design, simulation, system integration and manufacturing. Many products in the new release incorporate ‘single-click’ automated integrations that can enable users to leverage additional technology to broaden their scope of simulation.

Product and process integration also allows a smooth transfer of data between applications, which increases usability and productivity. For instance, Ansys 2021 R2 offers new Chip-Package-System (CPS) and printed circuit board (PCB) enhanced workflows with automation for IC-on-Package and Multi-Zone PCBs with rigid flex cables, which are popular in modern electronic devices.

Improvements to data visibility and reuse via dashboards and dedicated libraries should also further increase the efficiency, with libraries for common digital twin components, electronic components and materials enable engineers to quickly access trusted data.

For example, materials management updates enable customers using restricted substances to access the latest Supplier Data Sheets (SDSs), ensuring products are compliant with global regulations.

“Simulation is not just about solving advanced multiphysics design problems to us,” said Ansys senior VP Products Shane Emswiler. “It includes considering the entire product workflow and function necessary to enable our customers’ success.

“From automotive to industrial to aerospace and advanced electronics, Ansys is the leading provider of mission-critical integrated solutions that help customers build their products and systems for success.”

For all the Ansys product suite specific updates, you can click here.