Holo PureForm launched for copper 3D Printing Posted by Stephen Holmes - March 24, 2021 Service manufacturing side of Holo is already one of world's largest AM metal parts producers
Copper3D – hacking materials to fight bacteria Posted by Stephen Holmes - September 17, 2019 Could a 3D-printed material have as wide an impact in the future as penicillin did in the past? Stephen Holmes…
Oxidation resistant nano-copper particle process to improve 3D printed circuitry Posted by Stephen Holmes - June 7, 2017 The oxidation resistant copper nanoparticles are packed into a unique spherical cluster Nano Dimension Technologies has announced its development of…
D2 tool steel qualified for Desktop Metal Studio System 2 Posted by DEVELOP3D - December 7, 2021 A two-step bound metal additive manufacturing process
Stress test: AM’s simulation challenge Posted by Laurence Marks - December 6, 2021 Laurence Marks on additive manufacturing's simulation challenge
Holo launches high volume MicroAM metals platform Posted by DEVELOP3D - August 25, 2021 Capable of 50μm details in copper, stainless steels and other metals
HTC Vive Focus 3 targets pros with Snapdragon XR2 platform Posted by Stephen Holmes - May 13, 2021 Twice the CPU and GPU performance and 11x the AI processing compared to predecessor
Desktop Metal Studio System 2 eliminates solvent debind phase Posted by DEVELOP3D - February 2, 2021 New shortened, two-step process, eliminate use of chemical solvents
Dyndrite announces its Top 8 Emerging Companies for DMID Posted by Stephen Holmes - January 18, 2021 8 emerging companies that will present to more than 70 Investors, and 200 industry attendees
InnoventPro sees ExOne add nanoparticles to binder jetting Posted by DEVELOP3D - September 24, 2020 InnoventPro