Ansys 2024 R2 IC design - TwinAI software MAIN

New TwinAI and HFSS-IC solver introduced in Ansys 2024 R2

154 0

The Ansys 2024 R2 release looks to fuel collaboration and digital transformation with the introduction of two new products — Ansys TwinAI software for enhancing simulation with artificial intelligence and Ansys HFSS-IC solver for deep electromagnetic analysis of integrated circuits (IC).

Multiple R2 enhancements are focused on accelerating run times, scaling capacity and providing hardware flexibility to help optimise complex design tasks, with enhancements to connected workflows across the Ansys portfolio.

Ansys TwinAI software can combine insights from real-world data with the accuracy of multidomain models. This release also includes improvements to enable scaled deployments to the cloud or edge, allowing customers to unlock additional insights from real-world data.

“Innovation fuels progress, and at Tata Steel Nederland, we’re pioneering a transformative journey towards sustainability,” said Paul van Beurden, knowledge group leader – R&D, Tata Steel Nederland. “By harnessing the power of Ansys TwinAI software, we’re optimising our production processes, minimising energy loss, and driving towards our decarbonisation reduction targets of 30-40% by 2030 and being carbon neutral by 2045. Ansys technology is instrumental in getting us there.”

The Ansys Missions AI + tool is another new technology working with algorithms focused on enhancing Ansys Digital Mission Engineering (DME) products for space. Engineers can automatically evaluate the quality of resulting orbit solutions with tuned models to provide expert-level analysis and enhanced safety of flight routines.

Infusing AI into Ansys DME solutions allows users of varying simulation expertise to access and deploy the technology with ease.

There are other uses for Ansys AI integrations in creating design efficiencies for nanometre-scale semiconductor applications. Ansys RaptorX electromagnetic modelling software now includes an AI-driven IC floorplan optimisation solution, which identifies the ideal layout for mitigating electromagnetic coupling issues in analogue and RF IC designs. By combining the power of the RaptorX solver with AI, users can reduce circuit footprint and shrink design time from weeks to days.

Advertisement
Advertisement

The new release of R2 makes it easier for users to comprehensively evaluate cost and performance throughout a product’s lifecycle, from complex chips to electric vehicle powertrains.

Advanced packaging techniques for next-generation IC designs promise significant performance gains but increase design complexity. The new Ansys HFSS-IC solver addresses the growing complexity of today’s advanced chip designs. Integrating Ansys’ electronic and semiconductor technologies, the new HFSS-IC solver can tackle deep electromagnetic analysis for IC sign-off across power and signal integrity analysis.

To tackle multiphysics design challenges – present in nearly every industry, including automotive noise, vibration, and harshness (NVH) – enhancements to Ansys Mechanical structural simulation software for e-powertrain workflows should help boost overall productivity of NVH analyses by delivering more accurate test correlation, acoustics simulation, and speed improvements.

“Ansys 2024 R2 makes our portfolio deeper, broader, smarter, and more connected than it’s ever been,” said Shane Emswiler, senior VP of products at Ansys.

“Customers rely on Ansys software that spans the entire range of physics and domains, from systems simulation to digital twins. We look forward to the truly transformational innovations our customers will engineer with Ansys’ pervasive simulation insights.”

The release also includes improved data transfer between the Ansys Zemax optical system design software and the Ansys Speos optical performance analysis solver to more efficiently evaluate and optimise optical designs, including large systems with complex fields and wavelengths.

For example, the integration unlocks streamlined straylight analysis for optical systems to help users eliminate unwanted effects caused by lens flare, light leakage, and scattering in optical systems.

Ansys technology in 2024 R2 facilitates highly scalable high-performance computing (HPC) deployment, with all solver technologies optimised to run on CPUs and a growing list of solutions optimised for the latest GPU hardware from multiple vendors.

This list includes the Ansys AVxcelerate Sensors software for autonomous system testing, which now features adaptive grid sampling for long range object detection. Adaptive grid sampling allows simulation users to narrow their focus on specific objects within a virtual driving scenario to gather more targeted data. When compared to global sampling, which gathers all data from a driving scenario resulting in oversampling, the AVxcelerate Sensors enhancement reportedly deliver three-times faster simulation and 6.8-times less GPU memory consumption with the same or better level of object detection and predictive accuracy.

Ansys Fluent fluid simulation software boasts new hardware compatibility with AMD GPUs, supporting a broader selection of hardware options.

Users working on acoustics, reacting flows, or subsonic/transonic compressible flows can now leverage the multi-GPU solver to run their simulations at exponentially faster speeds with the expansion of physics modelling capabilities. Embedded integration of Ansys optiSLang process integration and design optimisation software supports further exploration of design options through built-in parametric optimisation.


Leave a comment