New E-Cool Toolset in STAR-CCM+ enables improved thermal insight of electronics systems

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New E-Cool ability can aid simulation for effective heat dispersal from electronic components

Siemens PLM has released STAR-CCM+ v11.06, the first to align with Siemens’ Smart Innovation Portfolio, and introducing new tools for the optimisation of electronics cooling.

Parts such as fans, heatsinks, chips, and boards can be imported from industry-standard IDF files, or created in STAR-CCM+, allowing the Electronics Cooling Toolset (E-Cool) to facilitate the creation and manipulation of the components for thermal performance analysis of board and system level electronics devices.

“This new capability allows engineers to focus their time on making the right decisions for improving the thermal efficiency of their electronics systems,” said Siemens PLM Software senior VP of product management Jean-Claude Ercolanelli.
“It utilises an entirely new concept for quickly managing and exploring their entire product design space to match their industrial engineering objectives.”

Other enhancements as part of this release include Source Smoothing for automatically smoothing and coarsening of the underlying CFD mesh to make it more appropriate for DEM calculations.

This provides the benefit of shortening the computational time of DEM simulations, ultimately allowing engineers to evaluate more design configurations in the same amount of time.



For applications like multiphase flow through nozzles and orifices, bubbly flow or counter gravity flow, Adaptive Multiple Size Group Population Balance (A-MUSIG) allows users to accurately model flows where the dispersed phase of bubbles, droplets or particles has a varied population in terms of size.

The new Simulation Tree Comparison feature, meanwhile, increases usability by allowing the side-by-side comparison of the simulation setup from two different cases. Users can easily identify differences or variations from best practices, saving time in checking their simulation setup.

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